{"id":4493,"date":"2017-10-13T11:50:13","date_gmt":"2017-10-13T09:50:13","guid":{"rendered":"http:\/\/test.jonas-redmann.at\/geschaeftsfelder\/photovoltaik\/tray-automation\/"},"modified":"2021-05-19T11:06:34","modified_gmt":"2021-05-19T09:06:34","slug":"tray-automation","status":"publish","type":"page","link":"https:\/\/www.jonas-redmann.com\/en\/geschaeftsfelder\/photovoltaik\/tray-automation\/","title":{"rendered":"HJT Tray Automation"},"content":{"rendered":"

[vc_row][vc_column][vc_column_text css=”.vc_custom_1557748852534{margin-bottom: 20px !important;}”]<\/p>\n

HJT T<\/strong>ray A<\/strong>utomation<\/span><\/h1>\n

[\/vc_column_text][vc_empty_space height=”14px” css=”.vc_custom_1505468491550{background-image: url(https:\/\/www.jonas-redmann.com\/wp-content\/uploads\/2017\/04\/stripes_rot_dick.gif?id=681) !important;background-position: 0 0 !important;background-repeat: repeat !important;}”][vc_column_text css=”.vc_custom_1557751242537{margin-top: 20px !important;}”]The highly sophisticated machine platform HJT TRAY AUTOMATION<\/strong> ensures the fully automated loading and unloading of trays for inline-coating processes. Outstanding innovation is the particularly surface-friendly, yet high-performance handling of wafers in inline flat-carrier transport. This involves high-precision, row-by-row positioning of the wafers which are individually measured. Any deviations from the target dimensions are automatically compensated for. During the measurement and compensation process, the measurement system takes temperature-dependent length extension of the trays in to account as well. Thus the system is ideally suited to handle ultra-thin wafers with highly-sensitive coats.[\/vc_column_text][vc_single_image image=”1538″ img_size=”full” el_class=”img-full”][vc_column_text css=”.vc_custom_1557751288828{margin-bottom: 0px !important;}”]<\/p>\n

HJT Tray Automation Configuration<\/span><\/h3>\n

[\/vc_column_text][vc_empty_space height=”14px” css=”.vc_custom_1513164317569{margin-top: 14px !important;margin-bottom: 14px !important;background-image: url(https:\/\/www.jonas-redmann.com\/wp-content\/uploads\/2017\/04\/stripes_rot_dick.gif?id=681) !important;background-position: 0 0 !important;background-repeat: repeat !important;}”][vc_column_text]The modular HJT TRAY AUTOMATION enables a custom-tailored configuration in regard to the wafer infeed and outfeed, the integration of measurement and control systems, interface integration with process equipment as well as tray type.<\/p>\n

The system can achieve a throughput rate of 6,500 wafer\/h with less than\u00a0 0.03 % failure rate, making it the most efficient system available on the market for the loading and unloading of inline coating systems in the production of heterojunction<\/strong> solar cells.[\/vc_column_text][vc_column_text css=”.vc_custom_1516135549904{margin-bottom: 0px !important;}”]<\/p>\n

Technical Data and Features
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[\/vc_column_text][vc_empty_space height=”14px” css=”.vc_custom_1513164317569{margin-top: 14px !important;margin-bottom: 14px !important;background-image: url(https:\/\/www.jonas-redmann.com\/wp-content\/uploads\/2017\/04\/stripes_rot_dick.gif?id=681) !important;background-position: 0 0 !important;background-repeat: repeat !important;}”][vc_column_text]Configurable for a number of processes, such as PECVD and PVD\u00a0<\/span><\/p>\n

Perfectly adapted to process equipment for the production of solar cells with heterojunction technology<\/strong> (HJT)<\/span><\/p>\n

High process quality due to the innovative handling and\u00a0<\/span>precise\u00a0positioning of wafers on the tray<\/p>\n

Sensor\/ Camera controlled wafer alignment for optimum wafer position into tray pockets and\u00a0easy integration of customized measurement needs (thickness, color)<\/span><\/p>\n

Single-end or double-end configuration available<\/span><\/p>\n

Virtual material tracking<\/span>[\/vc_column_text][vc_column_text css=”.vc_custom_1516100658718{margin-bottom: 0px !important;}”]<\/p>\n

Options<\/span><\/h3>\n

[\/vc_column_text][vc_empty_space height=”14px” css=”.vc_custom_1513164317569{margin-top: 14px !important;margin-bottom: 14px !important;background-image: url(https:\/\/www.jonas-redmann.com\/wp-content\/uploads\/2017\/04\/stripes_rot_dick.gif?id=681) !important;background-position: 0 0 !important;background-repeat: repeat !important;}”][vc_column_text]MES SECS \/ GEM PV2<\/span><\/p>\n

Color inspection system with reject bins
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Breakage detection for unprocessed wafers
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Wafer Flipper<\/span><\/p>\n

Tray Buffer<\/span><\/p>\n

Wafer Rotation<\/span>[\/vc_column_text][vc_column_text]\n\n

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